Thin Films Specialist, Silicon Assembly (Starlink)

THIN FILMS SPECIALIST, SILICON ASSEMBLY (STARLINK)

One of the most ambitious missions that SpaceX has undertaken to date, the Starlink satellite constellation, is our solution to providing reliable internet to the entire world. In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. You will work closely with IC packaging engineers, test engineers, equipment manufacturers, and leadership.

The success of Starlink depends on the quality, reliability, cost, manufacturability, throughput, and security of the products that you deliver. If you seek a fast-paced, dynamic environment; if you thrive on solving difficult problems where resolutions have high impact; and if you love the challenge of building something from scratch, then this role will be an ideal next career step.

RESPONSIBILITIES:

• Operate and maintain deposition systems, including physical vapor deposition (PVD) to deposit precise thin films of metals, dielectrics, and semiconductors
• Develop and optimize deposition recipes by tuning parameters such as temperature, pressure, gas flow rates, and precursor delivery to achieve target film thickness and composition levels
• Monitor process performance using in-situ sensors and metrology equipment like 3D profilometers, ellipsometers, reflectometers, and X-ray fluorescence (XRF) to ensure film uniformity, step coverage, and contamination control
• Troubleshoot equipment malfunctions, analyze process drifts, and perform root cause investigations to minimize defects and enhance deposition rates
• Collaborate with process integration, lithography, and etching teams to qualify new materials and integrate deposition steps into overall device fabrication flows
• Document process data, prepare reports on key metrics (e.g., deposition rate, film resistivity, refractive index), and contribute to design of experiments (DOE) for process enhancements
• Comply with cleanroom protocols, hazardous gas handling safety standards
• Assist in tool installations, preventive maintenance, and qualification testing to support high-volume production and rapid prototyping

BASIC QUALIFICATIONS:

• High school diploma or equivalency certificate
• 3+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline

PREFERRED SKILLS AND EXPERIENCE:

• Bachelor's degree in materials science, electrical engineering, or a related field
• 3+ years of practical experience in semiconductor deposition processes in a fab setting
• Strong knowledge of deposition methods, including ALD, PECVD, LPCVD, PVD, plasma sputtering with understanding of various thin film properties and high vacuum environments
• Proficiency in data analysis and process control software (e.g., JMP, Excel) for statistical process control (SPC) and trend analysis
• Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates
• Experience with high-k dielectrics, advanced metals (e.g., Cu, Ti, SuS), or 3D structures
• Background in R&D projects involving novel thin films, such as perovskites or graphene, and integration with factory automation systems
• Certification in semiconductor manufacturing or knowledge of ISO and SEMI standards
• Background in yield optimization, automation integration (e.g., with fab MES systems), or lean Six Sigma methodologies

ADDITIONAL REQUIREMENTS:

• Must be able to work all shifts and be willing to work overtime and/or weekends as needed
• Standing for long periods of time, climbing up and down ladders, bending, grasping, sitting, pulling, pushing, stooping, and stretching may be required to perform the functions of this position
• Must be able to lift up to 35lbs. unassisted