2027校招-封装工程师/Packaging Engineer
Posted by employer 1 month ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Engineer at Texas Instruments focuses on developing and optimizing packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and design software, along with a solid understanding of semiconductor manufacturing processes. This role is ideal for mid to senior-level engineers with a background in electrical engineering or materials science. Texas Instruments is known for its innovative approach and commitment to quality in the semiconductor industry.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Texas Instruments's career page.
- Texas Instruments has 724 other open roles including Analog/Mixed-Signal IC Design Manager | High Performance Radar, Sales Engineering Intern (Santa Clara, CA), Software Development Engineer Development Program.