3DIC Platform Wet and Plating Development Manager
Posted by employer 1 day ago
First seen on Joblaze 10 hours ago
Last verified on the company career page 10 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
The 3DIC Platform Wet and Plating Development Manager oversees the development and optimization of wet processing and plating processes for advanced packaging technologies. This role requires expertise in semiconductor manufacturing, particularly in wet chemistry and plating techniques, along with strong project management skills. It is suited for candidates with a solid background in engineering and experience in semiconductor fabrication, ideally at a senior level. The position is part of Intel's ongoing efforts to enhance its packaging capabilities in a competitive market.
Joblaze insights
- Listed today — first seen on Joblaze October 9, 2026. Last confirmed on Intel's careers page October 9, 2026.
Quick facts
- Is the 3DIC Platform Wet and Plating Development Manager role remote?
- No — this is an on-site role in Hillsboro, Oregon, United States.
- Where is the role based?
- Intel is hiring for this position in Hillsboro, Oregon, United States.
- What seniority level is this role?
- Intel targets lead candidates for this position.
- Is this full-time or contract?
- Full-time for this 3DIC Platform Wet and Plating Development Manager role at Intel.