Posted by employer 2 months ago
First seen on Joblaze 5 hours ago
Last verified on the company career page 5 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
In this role, the engineer focuses on developing advanced packaging dry etch modules, ensuring they meet performance and reliability standards. Key skills include expertise in semiconductor processing, etching techniques, and familiarity with relevant software tools. This position is suited for experienced engineers with a background in semiconductor manufacturing and a strong understanding of process development. The team operates within a leading technology company that emphasizes innovation in chip design and manufacturing.
Joblaze insights
- Listed today on Joblaze — tracked directly from Intel's career page.
- Intel has 689 other open roles including Silicon Design - Flows and Methodology Intern, RTL Design Engineering Student, RTL Design Engineer.
Quick facts
- Is the Advanced Packaging Dry Etch Module Development Engineer role remote?
- No — this is an on-site role in Hillsboro, Oregon, United States.
- Where is the role based?
- Intel is hiring for this position in Hillsboro, Oregon, United States.
- What seniority level is this role?
- Intel targets mid-level candidates for this position.
- Is this full-time or contract?
- Full-time for this Advanced Packaging Dry Etch Module Development Engineer role at Intel.