Senior Die Bond/Die Attach Equipment Engineer
Posted by employer 1 week ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 hour ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
In this role, the engineer focuses on the design and optimization of die bond and die attach processes, ensuring high-quality production standards. Proficiency in semiconductor manufacturing techniques and experience with equipment such as wire bonders and die attach machines are essential. This position is ideal for seasoned professionals with a background in electrical engineering or materials science, particularly those who thrive in fast-paced environments. Texas Instruments is known for its innovative approach, making this a dynamic opportunity for growth.
Joblaze insights
- Listed 8 days ago on Joblaze — tracked directly from Texas Instruments's career page.
- Texas Instruments has 751 other open roles including Career Accelerator Program - Industrial Engineer - North Texas, Technical Sales Program (East Region), Technical Sales Program (Waltham, MA).
Quick facts
- Is the Senior Die Bond/Die Attach Equipment Engineer role remote?
- No — this is an on-site role in Wilayah Persekutuan Kuala Lumpur, Malaysia.
- Where is the role based?
- Texas Instruments is hiring for this position in Wilayah Persekutuan Kuala Lumpur, Malaysia.
- What seniority level is this role?
- Texas Instruments targets senior candidates for this position.
- Is this full-time or contract?
- Full-time for this Senior Die Bond/Die Attach Equipment Engineer role at Texas Instruments.