Join Intel's Advanced Packaging Internship Program to gain hands-on experience in advanced packaging technologies.
Posted by employer 1 week ago
First seen on Joblaze 1 week ago
Last verified on the company career page 5 days ago
Requirements
- Education
- Bachelor's degree
Not disclosed in this posting: compensation, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Advanced Packaging Internship Program at Intel involves hands-on experience in developing and optimizing advanced packaging technologies, where interns will engage in various projects that enhance product performance. Key skills include knowledge of semiconductor packaging, materials science, and proficiency in relevant software tools. This role is ideal for students or recent graduates in engineering or related fields, particularly those with a strong interest in semiconductor technology. Intel's commitment to innovation and cutting-edge research makes this an exciting opportunity for aspiring engineers.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.
Quick facts
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- Internship for this Advanced Packaging Internship Program role at Intel.