Posted by employer 3 days ago
First seen on Joblaze 1 day ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Advanced Packaging Integration and Simulation Intern at Intel focuses on supporting the development and optimization of advanced packaging technologies through simulation and analysis. Key skills for this role include proficiency in simulation tools, knowledge of semiconductor packaging processes, and a solid foundation in engineering principles. This position is well-suited for students or recent graduates with a background in electrical or materials engineering, looking to gain hands-on experience in a leading technology company.
Joblaze insights
- Listed yesterday on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Software Research Engineering - (PhD Intern), APTM Facilities Ops AMR Cost Specialist.
Quick facts
- What seniority level is this role?
- Intel targets intern candidates for this position.
- Is this full-time or contract?
- Internship for this Advanced Packaging Integration and Simulation Intern role at Intel.