Posted by employer 3 days ago
First seen on Joblaze 1 day ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The C4 Bump Module Equipment Technician at Intel is responsible for maintaining and troubleshooting equipment used in the semiconductor manufacturing process. This role requires expertise in equipment operation, along with skills in diagnostics and repair, particularly in a high-tech environment. It is suited for individuals with a background in engineering or technical fields, ideally with experience in semiconductor fabrication. The position is part of a team focused on optimizing production efficiency in a leading technology company.
Joblaze insights
- Listed yesterday — first seen on Joblaze November 14, 2026. Last confirmed on Intel's careers page November 14, 2026.
- This exact title is also open at 1 other location at Intel: Penang, Malaysia.