Electromagnetics (EM) and Packaging Design Engineer
Posted by employer 11 hours ago
First seen on Joblaze 1 hour ago
Last verified on the company career page 1 hour ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Electromagnetics and Packaging Design Engineer at Texas Instruments focuses on developing and optimizing electromagnetic designs and packaging solutions for semiconductor products. Proficiency in electromagnetic simulation tools and a solid understanding of thermal and mechanical design principles are essential for this role. This position is suitable for engineers with a background in electrical or mechanical engineering, ideally with experience in product development. Texas Instruments emphasizes collaboration within a team dedicated to advancing semiconductor technology.
Joblaze insights
- Listed today — first seen on Joblaze October 27, 2026. Last confirmed on Texas Instruments's careers page October 27, 2026.