Mechanical Engineer - Thermal Design

Reports to: Head of Hardware

Type: Full-Time

The Role

Our systems are built for continuous operation in harsh, remote, and mission-critical environments where reliability is non-negotiable. The difference between a lab prototype and a fielded capability is often heat. Sealed, rugged electronics must reject the power they dissipate across extreme temperature swings, often with limited or no forced airflow, for the life of the mission.

This role converts system requirements into thermal architectures and hardware that keep sensitive electronics within their limits and can be produced at scale and serviced in the field. You'll drive the thermal design, analysis, and validation of mission-critical electronics, from early concept and simulation through prototyping, test, and ramp to production with suppliers.

What You'll Do

• Design and develop thermal management solutions, including heat sinks, heat spreaders, thermal interface materials, and conduction paths, for sealed, rugged electronics operating continuously in harsh, remote environments.

• Perform thermal analysis, simulation (e.g., CFD), and hand calculations to predict component temperatures, identify hot spots, and ensure reliable performance across extreme hot and cold conditions.

• Collaborate with electrical and systems engineers on power dissipation budgets, component placement, and material selection to optimize thermal performance at the system level.

• Plan and execute thermal testing and validation, correlate models to test data, and drive design revisions based on test and field feedback.

• Develop CAD models (in SolidWorks) of thermal hardware, along with engineering calculations and design documentation that comply with engineering standards.

• Work closely with mechanical, manufacturing, and supply chain teams to ensure thermal solutions meet cost, weight, size, and production constraints, applying DFM and DFA principles.

• Contribute to continuous improvement of thermal design standards, test procedures, and product documentation.

What You Bring

• Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or a related field.

• 4–7 years of experience in thermal design and analysis for electronic systems, ideally rugged, sealed, or harsh-environment hardware.

• Proficiency in SolidWorks.

• Experience with thermal simulation and CFD tools (ANSYS Icepak or Fluent, Simcenter FloTHERM, SolidWorks Flow Simulation, or similar).

• Strong understanding of heat transfer fundamentals (conduction, convection, radiation) and thermal management techniques for electronics, such as heat sinks, heat spreaders, heat pipes, thermal interface materials, and conduction paths.

• Knowledge of materials and manufacturing processes relevant to thermal hardware, such as machining, extrusion, and die casting.

• Experience with thermal test methods and instrumentation (thermocouples, IR thermography, environmental chambers) and correlating test results to models.

• Familiarity with environmental test standards for rugged electronics (e.g., MIL-STD-810).

• Ability to produce clear technical documentation and engineering drawings.

Nice to Have

• Experience designing thermal hardware that works reliably in sub-zero environments.

• Ability to design passive cooling and heating solutions that minimize power draw.

No defence background required.

At Dominion Dynamics, you’ll:

• Shape Canada’s future by building real defence capability for the CAF and our allies.

Compensation & Benefits

• Competitive base salary and company equity*

• Comprehensive health benefits

• Additional equity granted based on impact*

*Equity awarded to full time employees only.