Packaging Engineering Intern MS/PhD
Posted by employer 1 week ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Requirements
- Education
- Master's degree
Not disclosed in this posting: compensation, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Engineering Intern at Texas Instruments engages in hands-on projects related to semiconductor packaging, focusing on design and testing processes. Proficiency in CAD software and a solid understanding of materials science are essential for success in this role. This position is ideal for graduate students pursuing a master's or PhD in engineering or a related field, looking to gain practical experience in a leading technology company. Texas Instruments is known for its innovative approach and commitment to developing cutting-edge solutions.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Texas Instruments's career page.
- Texas Instruments has 724 other open roles including Analog/Mixed-Signal IC Design Manager | High Performance Radar, Sales Engineering Intern (Santa Clara, CA), Software Development Engineer Development Program.
Quick facts
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- Texas Instruments targets intern candidates for this position.
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- Internship for this Packaging Engineering Intern MS/PhD role at Texas Instruments.