Posted by employer 3 months ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
In this role, the Principal Engineer focuses on developing and optimizing hybrid bonding modules, ensuring they meet performance and reliability standards. Key skills include expertise in semiconductor technology, materials science, and advanced packaging techniques. This position is ideal for experienced engineers with a strong background in semiconductor manufacturing and a passion for innovation. Intel's commitment to cutting-edge technology and collaborative team dynamics makes this an exciting opportunity for those looking to make a significant impact.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.
Quick facts
- Is the Principal Engineer, Hybrid Bonding Module role remote?
- It's hybrid — Intel expects some on-site time in US, Oregon, Hillsboro.
- Where is the role based?
- Intel is hiring for this position in US, Oregon, Hillsboro.
- What seniority level is this role?
- Intel targets principal-level candidates for this position.
- Is this full-time or contract?
- Full-time for this Principal Engineer, Hybrid Bonding Module role at Intel.