Join Helion as a Principal Power Electronics Packaging Engineer to lead the development of next-generation packaging solutions for fusion power technology.
Posted by employer 3 months ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Skills & Technologies
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Benefits
Joblaze summary
The Principal Power Electronics Packaging Engineer at Helion is responsible for designing advanced packaging solutions for high-current switching components in fusion power systems. This role requires expertise in thermal management, materials selection, and cooling system design, along with hands-on experience in power electronics for demanding applications. Ideal candidates will have a strong background in translating research into practical hardware, making this position suitable for seasoned engineers looking to impact the future of energy. Helion's innovative environment emphasizes collaboration and rapid iteration, aligning with its mission to revolutionize clean energy.
Joblaze insights
- Listed 9 days ago on Joblaze — tracked directly from Helion's career page.
- Helion has 95 other open roles including Corporate Communications Specialist, Senior Manufacturing Engineer, Manufacturing Engineer.
- 94 active power electronics roles on Joblaze right now.
- 18 active Thermal management roles on Joblaze right now.
- 4 active SCRs roles on Joblaze right now.
- Typical power electronics salary we track runs $120,000–$153,750 (median $130,000, across 38 roles).
Quick facts
- Is the Principal Power Electronics Packaging Engineer role remote?
- No — this is an on-site role in Everett, WA.
- Where is the role based?
- Helion is hiring for this position in Everett, WA.
- What's the tech stack?
- Joblaze extracted these technologies from the posting: SCRs, Thermal management, diodes, high-current switching components, packaging architectures, power electronics.
- What seniority level is this role?
- Helion targets principal-level candidates for this position.
- Is this full-time or contract?
- Full-time for this Principal Power Electronics Packaging Engineer role at Helion.
From the original posting
About Helion
We are a fusion power company based in Everett, WA, with the mission to build the world's first fusion power plant, enabling a future with unlimited clean electricity. Our vision is a world with clean, reliable, and affordable energy for everyone.
Since Helion's founding in 2013, we have raised $1.5 billion from long-time investors such as Sam Altman, Mithril, and Capricorn Investment Group as well as new investors including Thrive Capital, LightSpeed Venture Capital, SoftBank, and others to propel us forward. Our current prototype, Polaris, has reached record-breaking plasma temperatures of 150 million degrees Celsius (13 keV). Helion is continuing to iterate and on the path to the world's first fusion power plant, Orion.
This is a pivotal time to join Helion. You will tackle real-world challenges with a team that prizes urgency, rigor, ownership, and a commitment to delivering hard truths – values essential to achieving what no one has before. Together, we will change the future of energy, because the world can't wait.
What You Will Be Doing:
The switching systems in a commercial fusion generator will need to handle extreme pulsed currents in mass-manufacturable package. We are looking for someone to design what the next generation of packaging looks like, working ahead of where technology currently is and defining what it needs to become.
You Will
Lead development of next-generation thermal management and packaging architectures for high-current switching components
Work across packaging geometry, materials selection, and cooling system design to push the performance ceiling of pulsed power switch assemblies
Collaborate with internal teams and industry partners to accelerate development of packaging solutions
Build test setups to validate thermal and electrical performance under realistic pulsed conditions and use that data to drive iteration
Required Skills
Hands-on experience with power electronics packaging for high-current or high-voltage applications
Strong thermal engineering fundamentals; comfortable with modeling and bench validation
Experience with SCRs, diodes, or similar power semiconductors in demanding environments
Proven experience translating research into tangible hardware and products
Benefits
Our total compensation package includes benefits, including but not limited to:
Medical, Dental, and Vision plans for employees and their families
31 Days of PTO (21 vacation days and 10 sick days)
10 Paid holidays, plus company-wide winter break
Up to 5% employer 401(k) match
Short term disability, long term disability, and life insurance
Paid parental leave and support (up to 16 weeks)
Annual wellness stipend
Helion is an equal opportunity employer and value diversity at our company. We do not discriminate based on race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. If you need assistance or an accommodation during the interview process, please let us know.