Posted by employer 2 days ago
First seen on Joblaze 17 hours ago
Last verified on the company career page 17 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, visa sponsorship.
Joblaze summary
In this role, the individual will oversee the integration of processes and programs related to hybrid bonding and 3D integrated circuits, ensuring smooth operations and effective collaboration across teams. Proficiency in semiconductor manufacturing processes, project management, and cross-functional leadership is essential. This position is suited for a senior professional with a strong background in engineering and program management, ideally with experience in advanced packaging technologies. The team operates within Intel's innovative environment, focusing on the development of next-generation semiconductor solutions.
Joblaze insights
- Listed today — first seen on Joblaze November 14, 2026. Last confirmed on Intel's careers page November 14, 2026.
Quick facts
- Is the Process Integration & Program Leader, Hybrid Bonding / 3DIC role remote?
- It's hybrid — Intel expects some on-site time in Hillsboro, Oregon, United States.
- Where is the role based?
- Intel is hiring for this position in Hillsboro, Oregon, United States.