Posted by employer 5 days ago
First seen on Joblaze 3 days ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Quantum Packaging Thermal Architect at Intel focuses on developing thermal management solutions for advanced quantum packaging systems, ensuring optimal performance and reliability. This role requires expertise in thermal analysis, materials science, and packaging design, along with proficiency in simulation tools. It is well-suited for experienced professionals with a background in semiconductor packaging or thermal engineering. The position is part of a team dedicated to pushing the boundaries of quantum technology within a leading tech company.
Joblaze insights
- Listed 3 days ago — first seen on Joblaze September 25, 2026. Last confirmed on Intel's careers page September 27, 2026.