Posted by employer 2 days ago
First seen on Joblaze 11 hours ago
Last verified on the company career page 11 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Quantum IC Package Substrate Design Engineer focuses on the design and development of advanced packaging solutions for quantum integrated circuits, ensuring optimal performance and reliability. Key skills include expertise in substrate design, materials science, and familiarity with simulation tools relevant to semiconductor packaging. This role is suited for experienced engineers with a background in electrical engineering or materials science, particularly those who have worked in semiconductor or advanced packaging environments. Intel's commitment to innovation in quantum technology underscores the importance of this position within their broader research initiatives.
Joblaze insights
- Listed today — first seen on Joblaze September 25, 2026. Last confirmed on Intel's careers page September 25, 2026.