Senior Packaging Development Engineer - Leadframe Package/Ceramic
Posted by employer 2 days ago
First seen on Joblaze 13 hours ago
Last verified on the company career page 13 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
In this role, the Senior Packaging Development Engineer focuses on designing and developing leadframe and ceramic packaging solutions for semiconductor products. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in CAD software and simulation tools. This position is ideal for experienced engineers with a background in semiconductor packaging and a strong understanding of manufacturing processes. Texas Instruments emphasizes innovation and collaboration within its engineering teams.
Joblaze insights
- Listed today — first seen on Joblaze October 17, 2026. Last confirmed on Texas Instruments's careers page October 17, 2026.
Quick facts
- Is the Senior Packaging Development Engineer - Leadframe Package/Ceramic role remote?
- No — this is an on-site role in Melaka, Malaysia.
- Where is the role based?
- Texas Instruments is hiring for this position in Melaka, Malaysia.
- What seniority level is this role?
- Texas Instruments targets senior candidates for this position.
- Is this full-time or contract?
- Full-time for this Senior Packaging Development Engineer - Leadframe Package/Ceramic role at Texas Instruments.