Senior Packaging Development Engineer - Substrate Modules
Posted by employer 2 days ago
First seen on Joblaze 16 hours ago
Last verified on the company career page 16 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
The Senior Packaging Development Engineer for Substrate Modules at Texas Instruments focuses on designing and developing advanced packaging solutions for semiconductor products. This role requires expertise in materials science, thermal management, and mechanical design, along with proficiency in CAD software and simulation tools. It is well-suited for experienced engineers with a background in semiconductor packaging or related fields. The position is part of a team dedicated to innovation in packaging technologies within a leading semiconductor company.
Joblaze insights
- Listed today — first seen on Joblaze October 17, 2026. Last confirmed on Texas Instruments's careers page October 17, 2026.
Quick facts
- Is the Senior Packaging Development Engineer - Substrate Modules role remote?
- No — this is an on-site role in Melaka, Malaysia.
- Where is the role based?
- Texas Instruments is hiring for this position in Melaka, Malaysia.
- What seniority level is this role?
- Texas Instruments targets senior candidates for this position.
- Is this full-time or contract?
- Full-time for this Senior Packaging Development Engineer - Substrate Modules role at Texas Instruments.