Advanced Packaging Metrology Engineering Manager
Posted by employer 1 week ago
First seen on Joblaze 1 week ago
Last verified on the company career page 19 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
The Advanced Packaging Metrology Engineering Manager oversees the development and implementation of metrology solutions for advanced packaging technologies, ensuring precision and quality in manufacturing processes. This role requires expertise in metrology tools and techniques, along with a strong background in semiconductor packaging and engineering management. It is suited for experienced professionals with a track record in leading technical teams and driving innovation in a fast-paced environment. Intel's focus on advanced packaging positions this role at the forefront of semiconductor technology.
Joblaze insights
- Listed 10 days ago — first seen on Joblaze October 1, 2026. Last confirmed on Intel's careers page October 11, 2026.
Quick facts
- Is the Advanced Packaging Metrology Engineering Manager role remote?
- No — this is an on-site role in US, Oregon, Hillsboro.
- Where is the role based?
- Intel is hiring for this position in US, Oregon, Hillsboro.
- What seniority level is this role?
- Intel targets lead candidates for this position.
- Is this full-time or contract?
- Full-time for this Advanced Packaging Metrology Engineering Manager role at Intel.