Posted by employer 1 month ago
First seen on Joblaze 4 days ago
Last verified on the company career page 4 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions, ensuring that products meet performance and reliability standards. Key skills include expertise in semiconductor packaging technologies, materials science, and proficiency in simulation tools. This role is suited for experienced engineers with a background in electrical or materials engineering, particularly those familiar with the semiconductor industry. Intel's emphasis on innovation in packaging technology reflects its commitment to maintaining a competitive edge in the market.
Joblaze insights
- Listed 4 days ago — first seen on Joblaze October 1, 2026. Last confirmed on Intel's careers page October 5, 2026.
- This exact title is also open at 5 other locations at Intel: US, Arizona, Phoenix, Phoenix, Arizona, United States, US, Arizona, Phoenix, US, Arizona, Phoenix, US, Arizona, Phoenix.