Posted by employer 2 days ago
First seen on Joblaze 4 hours ago
Last verified on the company career page 4 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
In this role, the engineer focuses on developing and implementing advanced defect inspection methodologies for semiconductor packaging processes. Proficiency in imaging systems, data analysis, and defect characterization is essential, along with a strong background in electrical engineering or materials science. This position is suited for experienced professionals who have a solid understanding of semiconductor manufacturing and inspection technologies. The team at Intel emphasizes innovation and collaboration, contributing to the company's leadership in the semiconductor industry.
Joblaze insights
- Listed today — first seen on Joblaze September 27, 2026. Last confirmed on Intel's careers page September 27, 2026.
Quick facts
- Is the Senior Advanced Packaging Defect Inspection Engineer role remote?
- No — this is an on-site role in US, Oregon, Hillsboro.
- Where is the role based?
- Intel is hiring for this position in US, Oregon, Hillsboro.
- What seniority level is this role?
- Intel targets senior candidates for this position.
- Is this full-time or contract?
- Full-time for this Senior Advanced Packaging Defect Inspection Engineer role at Intel.