Posted by employer 2 weeks ago
First seen on Joblaze 2 weeks ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
In this role, the Advanced Packaging Substrate Supplier Enablement Lead at Intel focuses on managing supplier relationships and ensuring the quality and performance of packaging substrates. The position requires expertise in semiconductor packaging technologies, supply chain management, and strong analytical skills. It is suited for a senior professional with a background in engineering or materials science, ideally with experience in supplier management. The role is part of a team dedicated to enhancing Intel's packaging capabilities in a competitive market.
Joblaze insights
- Listed 17 days ago — first seen on Joblaze September 23, 2026. Last confirmed on Intel's careers page October 9, 2026.
Quick facts
- Is the Advanced Packaging Substrate Supplier Enablement Lead role remote?
- No — this is an on-site role in US, Arizona, Phoenix.
- Where is the role based?
- Intel is hiring for this position in US, Arizona, Phoenix.
- What seniority level is this role?
- Intel targets lead candidates for this position.
- Is this full-time or contract?
- Full-time for this Advanced Packaging Substrate Supplier Enablement Lead role at Intel.