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Foundry Advanced Packaging Customer Engineer

Location
US, Arizona, Phoenix
Compensation
Not disclosed
Level
Not specified
Type
Not specified

Posted by employer 5 days ago

First seen on Joblaze 3 days ago

Last verified on the company career page 1 day ago

Apply at Intel → Save job Scanned from intel.com

Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.

Joblaze summary

In this role, the engineer focuses on providing technical support and solutions for advanced packaging technologies in customer environments. Proficiency in semiconductor manufacturing processes, packaging design, and customer engagement is essential. This position is well-suited for individuals with a strong background in engineering and experience in customer-facing roles. The team at Intel emphasizes collaboration and innovation, reflecting the company's commitment to advancing semiconductor technology.

Joblaze insights

  • Listed 3 days ago — first seen on Joblaze September 17, 2026. Last confirmed on Intel's careers page September 19, 2026.

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