Posted by employer 2 weeks ago
First seen on Joblaze 2 weeks ago
Last verified on the company career page 5 days ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Oregon Advanced Packaging Module Engineer is responsible for developing and optimizing advanced packaging solutions, focusing on enhancing performance and reliability. Key skills include expertise in semiconductor packaging technologies, materials science, and proficiency with design and simulation tools. This role is suitable for experienced engineers with a background in electrical or materials engineering, particularly those familiar with the semiconductor industry. Intel's team emphasizes innovation and collaboration, contributing to the company's leadership in technology.
Joblaze insights
- Listed 15 days ago — first seen on Joblaze October 29, 2026. Last confirmed on Intel's careers page November 8, 2026.