Posted by employer 2 months ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Package Failure Analysis Engineer conducts detailed investigations into packaging failures, utilizing advanced analytical techniques to identify root causes and recommend solutions. Proficiency in semiconductor packaging, materials science, and failure analysis methodologies is essential, along with strong problem-solving skills. This position is ideal for experienced engineers with a background in semiconductor manufacturing or materials engineering. Intel's focus on innovation and quality makes this a pivotal role within a dynamic team.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 695 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.