Posted by employer 1 week ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the engineer focuses on enhancing package assembly processes through integration and development efforts. Proficiency in engineering principles, along with experience in semiconductor packaging and process optimization, is essential. This position is ideal for mid to senior-level professionals with a background in electrical or mechanical engineering. The team at Intel is known for its innovative approach, contributing to cutting-edge technology in the semiconductor industry.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 695 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.