Posted by employer 2 months ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Principal Collateral Device Engineer at Intel focuses on designing and validating advanced semiconductor devices, ensuring they meet performance and reliability standards. Key skills include expertise in semiconductor physics, device modeling, and proficiency with simulation tools. This position is ideal for seasoned engineers with a strong background in device engineering and a track record of innovation in the semiconductor industry. Intel's commitment to cutting-edge technology and collaborative team dynamics enhances the appeal of this opportunity.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.
Quick facts
- What seniority level is this role?
- Intel targets principal-level candidates for this position.
- Is this full-time or contract?
- Full-time for this Principal Collateral Device Engineer role at Intel.