Posted by employer 1 day ago
First seen on Joblaze 16 hours ago
Last verified on the company career page 16 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
The Silicon Packaging Design Architect at Intel focuses on developing advanced packaging solutions for semiconductor products, ensuring optimal performance and reliability. Key skills include expertise in packaging design, materials science, and thermal management, along with proficiency in relevant software tools. This role is suited for experienced professionals with a strong background in electrical engineering or materials science, particularly those familiar with semiconductor manufacturing processes. Intel's emphasis on innovation in packaging technology highlights the importance of this role within the company's broader engineering efforts.
Joblaze insights
- Listed today — first seen on Joblaze October 1, 2026. Last confirmed on Intel's careers page October 1, 2026.
Quick facts
- Is the Silicon Packaging Design Architect role remote?
- No — this is an on-site role in Phoenix, Arizona, United States.
- Where is the role based?
- Intel is hiring for this position in Phoenix, Arizona, United States.
- What seniority level is this role?
- Intel targets senior candidates for this position.
- Is this full-time or contract?
- Full-time for this Silicon Packaging Design Architect role at Intel.