Posted by employer 3 months ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the engineer focuses on designing and developing advanced silicon packaging solutions, ensuring optimal performance and reliability. Proficiency in CAD tools, materials science, and thermal management techniques is essential for success. This position is ideal for experienced professionals with a background in semiconductor packaging and a strong understanding of electronic design principles. Intel's commitment to innovation and cutting-edge technology makes this a dynamic environment for growth.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.