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Semiconductor Packaging Research Engineer

Location
Phoenix, Arizona, United States
Compensation
Not disclosed
Level
Not specified
Type
Not specified

Posted by employer 3 days ago

First seen on Joblaze 1 day ago

Last verified on the company career page 1 day ago

Apply at Intel → Save job Scanned from intel.com

Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.

Joblaze summary

The Semiconductor Packaging Research Engineer at Intel focuses on developing and optimizing packaging solutions for semiconductor devices, ensuring performance and reliability. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in simulation tools. This role is suited for experienced engineers with a background in semiconductor technology and packaging processes. Intel's commitment to innovation in semiconductor solutions positions this team at the forefront of industry advancements.

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