Posted by employer 4 days ago
First seen on Joblaze 3 days ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
The Silicon Packaging Design Architect at Intel focuses on developing advanced packaging solutions for semiconductor products, ensuring optimal performance and reliability. This role requires expertise in materials science, thermal management, and mechanical design, along with proficiency in CAD tools and simulation software. It is suited for experienced professionals with a background in electrical engineering or materials engineering, particularly those who have worked in semiconductor packaging. The position is part of a team dedicated to innovation in packaging technologies within a leading tech company.
Joblaze insights
- Listed 3 days ago — first seen on Joblaze October 7, 2026. Last confirmed on Intel's careers page October 9, 2026.
- This exact title is also open at 1 other location at Intel: US, Arizona, Phoenix.
Quick facts
- Is the Silicon Packaging Design Architect role remote?
- No — this is an on-site role in US, Arizona, Phoenix.
- Where is the role based?
- Intel is hiring for this position in US, Arizona, Phoenix.
- What seniority level is this role?
- Intel targets senior candidates for this position.
- Is this full-time or contract?
- Full-time for this Silicon Packaging Design Architect role at Intel.