Posted by employer 2 days ago
First seen on Joblaze 17 hours ago
Last verified on the company career page 17 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Silicon Packaging Design Engineer at Intel focuses on developing and optimizing packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and CAD tools for design and simulation. This role is suited for experienced engineers with a background in electrical or mechanical engineering, particularly those familiar with semiconductor packaging processes. Intel's emphasis on innovation in chip technology highlights the importance of this role within their engineering teams.
Joblaze insights
- Listed today — first seen on Joblaze November 14, 2026. Last confirmed on Intel's careers page November 14, 2026.
- This exact title is also open at 2 other locations at Intel: India, Bangalore, India, Bangalore.