Posted by employer 2 days ago
First seen on Joblaze 20 hours ago
Last verified on the company career page 20 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Substrate Packaging Research and Development Engineer at Intel focuses on designing and optimizing packaging solutions for semiconductor devices, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in simulation tools. This role is suited for experienced engineers with a background in semiconductor packaging or related fields. Intel's commitment to innovation in chip technology underscores the importance of this position within their R&D team.
Joblaze insights
- Listed today — first seen on Joblaze September 29, 2026. Last confirmed on Intel's careers page September 29, 2026.