Posted by employer 5 days ago
First seen on Joblaze 2 days ago
Last verified on the company career page 20 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions, ensuring that products meet performance and reliability standards. Key skills include expertise in semiconductor packaging technologies, materials science, and proficiency in simulation tools. This role is suited for experienced engineers with a background in electrical engineering or materials science, particularly those familiar with the semiconductor industry. Intel's commitment to innovation in packaging technology positions this team at the forefront of the company's product development efforts.
Joblaze insights
- Listed 2 days ago — first seen on Joblaze September 19, 2026. Last confirmed on Intel's careers page September 21, 2026.
- This exact title is also open at 5 other locations at Intel: US, Arizona, Phoenix, US, Arizona, Phoenix, US, Arizona, Phoenix, US, Arizona, Phoenix, US, Arizona, Phoenix.