"chip level packaging" Jobs

5 open tech roles matching “chip level packaging”, taken straight from company career pages — not reposted from other job boards. Most in demand right now: SaaS, Sales, FC-BGA. Every listing is re-checked daily and closed roles are removed.

Showing 5 of 5 results

Senior ASIC Package Design Engineer Remote

Join K2 Space as a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture for high-performance satellites.

K2 Space United States - Remote $180k–$260k/yr Published 4 weeks ago

SIWave FC-BGA ADS MCM HFSS

Flexible on stack

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Principal ASIC Package Design Engineer Remote

Lead ASIC package design for high-performance satellites in a fast-paced, remote environment.

K2 Space United States - Remote $200k–$280k/yr Published 4 weeks ago

FC-BGA mixed-signal SoCs Signal integrity Power Delivery MCM

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Senior Director, Field Enablement Remote

Lead the global enablement function at PagerDuty to enhance sales and customer success capabilities in a high-growth SaaS environment.

PagerDuty Remote (USA - San Francisco, CA) $180k–$303.6k/yr Published 2 weeks ago

Sales Enablement SaaS

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Territory Executive - Illinois Remote

Own a territory of mid-sized customer accounts to drive growth and deepen executive relationships at PagerDuty.

PagerDuty Remote (USA) $105k–$126.5k/yr Published 1 month ago

Sales Account Management Consultative Selling SaaS

AI-first team

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Enterprise Account Executive - Florida Remote

Drive growth and expansion within an established customer portfolio as an Account Executive at PagerDuty.

PagerDuty Remote (USA) $131k–$170.5k/yr Published 1 month ago

Sales Cloud Software SaaS

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