Posted by employer 3 months ago
First seen on Joblaze 1 hour ago
Last verified on the company career page 1 hour ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The ADCE Packaging Design Architect at Intel focuses on developing advanced packaging solutions, ensuring that designs meet performance and reliability standards. Key skills include expertise in semiconductor packaging, thermal analysis, and proficiency with design tools like CAD. This role is suited for experienced professionals with a strong background in electrical engineering or materials science. The position is part of a team dedicated to innovation in semiconductor technology, contributing to Intel's ongoing advancements in the industry.
Joblaze insights
- Listed today on Joblaze — tracked directly from Intel's career page.
- Intel has 720 other open roles including Finance Rebate Analyst, CDAT Manufacture Technician, GPU IP Verification Engineer.