Posted by employer 1 month ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Packaging Module Development Engineer at Intel focuses on designing and optimizing packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in relevant software tools. This position is ideal for experienced engineers with a background in semiconductor packaging or related fields. Intel's commitment to innovation and technology advancement makes this a dynamic environment for professional growth.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 695 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.