Posted by employer 3 days ago
First seen on Joblaze 1 day ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in relevant software tools. This role is suited for experienced engineers with a background in semiconductor packaging or related fields. Intel's emphasis on innovation and technology advancement highlights the importance of this position within their engineering teams.
Joblaze insights
- Listed yesterday on Joblaze — tracked directly from Intel's career page.
- Intel has 695 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.