Posted by employer 2 days ago
First seen on Joblaze 1 day ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Research and Development Engineer at Intel focuses on designing and testing new packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in simulation tools. This role is suited for professionals with a strong background in engineering and experience in semiconductor packaging. Intel's commitment to innovation in technology drives the team's collaborative efforts in advancing packaging methodologies.
Joblaze insights
- Listed yesterday on Joblaze — tracked directly from Intel's career page.
- Intel has 695 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.