Posted by employer 4 months ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Packaging Module Development Engineer focuses on designing and optimizing packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Proficiency in materials science, thermal analysis, and CAD tools is essential, along with a solid understanding of semiconductor manufacturing processes. This position is ideal for experienced engineers with a background in electronics or materials engineering, looking to contribute to cutting-edge technology development. Intel's commitment to innovation and quality makes this a dynamic environment for professional growth.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 695 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.