Posted by employer 3 weeks ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Packaging Equipment Development Group Lead oversees the design and implementation of advanced packaging equipment, ensuring that production processes meet efficiency and quality standards. The position requires expertise in engineering principles, project management, and familiarity with semiconductor packaging technologies. This role is ideal for a senior professional with a strong background in equipment development and a track record of leading technical teams. Intel's focus on innovation and cutting-edge technology makes this a pivotal position within a dynamic and evolving environment.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 690 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.
Quick facts
- What seniority level is this role?
- Intel targets lead candidates for this position.
- Is this full-time or contract?
- Full-time for this Packaging Equipment Development Group Lead role at Intel.