Posted by employer 3 days ago
First seen on Joblaze 17 hours ago
Last verified on the company career page 17 hours ago
Not disclosed in this posting: compensation, years of experience, visa sponsorship.
Joblaze summary
The Senior Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in packaging technologies, materials science, and proficiency with simulation tools. This role is suited for experienced engineers with a background in electrical engineering or materials science, particularly those who have worked in semiconductor packaging. Intel's emphasis on innovation in packaging technology reflects its commitment to advancing chip performance.
Joblaze insights
- Listed today — first seen on Joblaze November 14, 2026. Last confirmed on Intel's careers page November 14, 2026.
Quick facts
- Is the • Senior Packaging Module Development Engineer role remote?
- No — this is an on-site role in Phoenix, Arizona, United States.
- Where is the role based?
- Intel is hiring for this position in Phoenix, Arizona, United States.
- What seniority level is this role?
- Intel targets senior candidates for this position.
- Is this full-time or contract?
- Full-time for this • Senior Packaging Module Development Engineer role at Intel.