Posted by employer 3 days ago
First seen on Joblaze 23 hours ago
Last verified on the company career page 23 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in relevant software tools. This role is suited for engineers with a strong background in semiconductor packaging and a few years of experience in the field. Intel's commitment to innovation in chip technology underscores the importance of this position within their engineering team.
Joblaze insights
- Listed today — first seen on Joblaze October 25, 2026. Last confirmed on Intel's careers page October 25, 2026.
- This exact title is also open at 5 other locations at Intel: US, Arizona, Phoenix, US, Arizona, Phoenix, Malaysia, Kulim, Malaysia, Kulim, US, Arizona, Phoenix.