Posted by employer 1 week ago
First seen on Joblaze 1 week ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Silicon Packaging Design Engineer at Intel focuses on developing and optimizing packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal analysis, and CAD tools, along with a strong understanding of electrical and mechanical design principles. This role is suited for experienced engineers with a background in semiconductor packaging or related fields. Intel's commitment to innovation in chip technology underscores the importance of this position within their engineering team.
Joblaze insights
- Listed 7 days ago — first seen on Joblaze October 3, 2026. Last confirmed on Intel's careers page October 9, 2026.
- This exact title is also open at 2 other locations at Intel: US, Arizona, Phoenix, US, Arizona, Phoenix.