Posted by employer 3 months ago
First seen on Joblaze 1 week ago
Last verified on the company career page 3 days ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions for semiconductor products, ensuring optimal performance and reliability. Proficiency in materials science, thermal analysis, and mechanical design is essential, along with experience in CAD tools and simulation software. This role is ideal for mid to senior-level engineers with a background in electrical engineering or materials science, who are looking to contribute to cutting-edge technology in a dynamic environment.
Joblaze insights
- Listed 7 days ago on Joblaze — tracked directly from Intel's career page.
- Intel has 695 other open roles including Silicon SoC Architect, Advanced Packaging Integration and Simulation Intern, APTM Facilities Ops AMR Cost Specialist.