Advanced Packaging SI/PI Engineer

Job Summary

As a Signal & Power Integrity Engineer you will be responsible for the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work closely with silicon, package, platform, and system teams to co-design world-class platforms with OSAT and ODM partners. Intense focus on pushing what is possible in power delivery and high-speed signaling for our silicon.

Key Responsibilities

• SI/PI analysis of designs and optimization within 2D/2.5D/3D packages

• Close interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performance

• Drive SI requirements into interposer/substrate layout (high-speed routing: 112G/224G) from preliminary design through tape-out.

• Drive PDN design and decoupling strategy across substrate and interposer, owning DC IR drop, dynamic IR drop, and impedance targets across all rails.

• Own ball map / C4 / BGA pin assignment from soft freeze through final freeze in partnership with package layout, ASIC PD, and board layout teams.

• Support board-level SI/PI and rack-level scale-up topology studies, including rack test vehicle design and cable characterization.

• Participating in cross-functional meetings and design reviews.

You may be a good fit if you have (Must-have qualifications)

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field with a strong understanding of signal integrity and power integrity concepts and fundamentals.

• 8+ years of SI/PI experience on high-performance ASIC, processor, or accelerator platforms.

• Proven experience defining and closing PDN for high-power silicon, including substrate and PCB plane design, decap strategy, and dynamic IR/EM analysis.

• Experience with developing systems with high-speed interfaces like HBM, SerDes and D2D interfaces.

• Hands-on expertise with one or more of: ANSYS HFSS / SIwave, Cadence Sigrity (PowerSI / PowerDC), Keysight ADS.

• Experience with CoWoS or equivalent advanced packaging materials and technologies including interposer SI/PI implications, C4 bump planning, and substrate stack-up trade-offs.

• Track record of designing and correlating SI/PI test vehicles against silicon measurement during bring-up and lab characterization.

• Strong analytical and communication skills, comfortable presenting risk, sign-off status, and trade-offs to cross-functional leadership.

• Deeply creative and able to think from first principles.

Strong candidates may also have experience with (Nice-to-have qualifications)

• Familiarity with full RTL-to-GDSII context and how PD decisions interact with package and board PDN.

• Experience with multi-die, 2.5D, or 3D packaging signoff, including chip-package-system (CPS) co-design.

• Project management experience coordinating across internal teams, OSAT partners, and PCB ODMs.

• Familiarity with modern ML and LLM model architectures, accelerator architectures, or HPC system design.

• Startup experience or comfort working in fast-paced environments.

Benefits

• Medical, dental, and vision packages with generous premium coverage

  • $500 per month credit for waiving medical benefits

• Housing subsidy of $2.5k per month for those living within walking distance of the office

• Daily lunch and dinner in our office

• Unlimited compute budget subject to ROI justification

How we’re different

Etched believes in the Bitter Lesson. We are the first inference-focused frontier AI system, betting early on transformer and transformer-like architectures and on increasing model sizes. Our addressable market is the entirety of inference, unlike many of our competitors.