Posted by employer 1 day ago
First seen on Joblaze 11 hours ago
Last verified on the company career page 11 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
In this role, the Advanced Packaging TD/Substrate Finance Specialist at Intel focuses on managing financial aspects related to advanced packaging technologies and substrate materials. Key skills include financial analysis, budgeting, and a strong understanding of semiconductor manufacturing processes. This position is suited for candidates with a background in finance or engineering, particularly those with experience in the semiconductor industry. The team operates within a leading technology company that emphasizes innovation in packaging solutions.
Joblaze insights
- Listed today — first seen on Joblaze September 19, 2026. Last confirmed on Intel's careers page September 19, 2026.