Posted by employer 3 days ago
First seen on Joblaze 1 day ago
Last verified on the company career page 1 day ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Oregon Advanced Packaging Module Engineer - Laser at Intel focuses on developing and optimizing laser processes for advanced packaging technologies. This role requires expertise in laser systems, optics, and materials science, along with strong problem-solving skills. It is suited for experienced engineers with a background in semiconductor packaging or laser technology. The position is part of a team dedicated to enhancing Intel's packaging capabilities, contributing to the company's innovation in chip manufacturing.
Joblaze insights
- Listed yesterday — first seen on Joblaze October 25, 2026. Last confirmed on Intel's careers page October 25, 2026.