Posted by employer 6 days ago
First seen on Joblaze 4 days ago
Last verified on the company career page 3 hours ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions for semiconductor products, ensuring they meet performance and reliability standards. Key skills include expertise in materials science, thermal management, and mechanical design, along with proficiency in relevant software tools. This role is suited for experienced engineers with a background in semiconductor packaging or related fields. The team is part of Intel's broader efforts to innovate in chip design and manufacturing.
Joblaze insights
- Listed 4 days ago — first seen on Joblaze October 1, 2026. Last confirmed on Intel's careers page October 5, 2026.
- This exact title is also open at 5 other locations at Intel: US, Oregon, Hillsboro, Phoenix, Arizona, United States, US, Arizona, Phoenix, US, Arizona, Phoenix, US, Arizona, Phoenix.