Posted by employer 2 days ago
First seen on Joblaze 1 hour ago
Last verified on the company career page 1 hour ago
Not disclosed in this posting: compensation, seniority, years of experience, work arrangement, visa sponsorship.
Joblaze summary
The Packaging Module Development Engineer at Intel focuses on designing and developing advanced packaging solutions, ensuring that products meet performance and reliability standards. Key skills include expertise in semiconductor packaging technologies, materials science, and proficiency in CAD tools. This role is suited for experienced engineers with a background in electrical or mechanical engineering, particularly those familiar with the semiconductor industry. Intel's commitment to innovation in packaging technology reflects its position as a leader in the tech sector.
Joblaze insights
- Listed today — first seen on Joblaze October 23, 2026. Last confirmed on Intel's careers page October 23, 2026.
- This exact title is also open at 5 other locations at Intel: US, Arizona, Phoenix, Malaysia, Kulim, Malaysia, Kulim, US, Oregon, Hillsboro, US, Arizona, Phoenix.